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| Official Title | Country | Tech sector | Faculties or Schools | Available for License | Patent Number | Patent Status | Filing Date | Inventor |
|---|---|---|---|---|---|---|---|---|
| A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis | International Procedure | Health Tech; Smart Hardware | Department of Biomedical Engineering | PCT/CN2010/075287 | 2010/07/20 |
ZHENG, Yongping (htzheng);CHEUNG, Chung Wai James (hte99404) |
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| A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis | United States of America | ; Smart Hardware | Department of Biomedical Engineering | 12/509,705 | 2009/07/27 |
ZHENG, Yongping (htzheng);CHEUNG, Chung Wai James (hte99404) |
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| A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis | Japan | ; Smart Hardware | Department of Biomedical Engineering | 2012-521946 | 2010/07/20 |
ZHENG, Yongping (htzheng);CHEUNG, Chung Wai James (hte99404) |
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| A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis | European Procedure (Patents) | ; Smart Hardware | Department of Biomedical Engineering | 10803888.6 | 2010/07/20 |
ZHENG, Yongping (htzheng);CHEUNG, Chung Wai James (hte99404) |
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| 用於評估脊柱側凸的三維(3D)超聲成像系統 | China | ; Smart Hardware | Department of Biomedical Engineering | 201080040696.0 | 2010/07/20 |
ZHENG, Yongping (htzheng);CHEUNG, Chung Wai James (hte99404) |
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| A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis | Canada | ; Smart Hardware | Department of Biomedical Engineering | 2,769,150 | 2010/07/20 |
ZHENG, Yongping (htzheng);CHEUNG, Chung Wai James (hte99404) |
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| A Three-dimensional (3D) Ultrasound Imaging System for assessing scoliosis | Australia | ; Smart Hardware | Department of Biomedical Engineering | 2010278526 | 2010/07/20 |
ZHENG, Yongping (htzheng);CHEUNG, Chung Wai James (hte99404) |
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| A method and system for bonding electrical devices using an electrically conductive adhesive | United States of America | ; Smart Hardware | Department of Electrical and Electronic Engineering | 12/546,207 | 2009/08/24 |
OR, Siu-wing Derek (eeswor) |
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| Method and system for bonding electrical devices using an electrically conductive adhesive | United States of America | ; Smart Hardware | Department of Electrical and Electronic Engineering | 13/340,168 | 2011/12/29 |
OR, Siu-wing Derek (eeswor) |
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| 使用導電膠黏合電氣裝置的方法與系統 | Taiwan | ; Smart Hardware | Department of Electrical and Electronic Engineering | 099128156 | 2010/08/24 |
OR, Siu-wing Derek (eeswor) |
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| 一種使用導電黏合劑黏接電氣設備的方法及系統 | China | ; Smart Hardware | Department of Electrical and Electronic Engineering | 201010262578.6 | 2010/08/24 |
OR, Siu-wing Derek (eeswor) |
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| Multilayer Nanofilber Filter | United States of America | Material Tech; Manufacturing Tech | Department of Mechanical Engineering | 12/775,465 | 2010/05/06 |
LEUNG, Woon Fong Wallace (mmwleung);HUNG, Chi-ho (NAME0835) |
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| Multilayer Nanofilber Filter | United States of America | Material Tech; Manufacturing Tech | Department of Mechanical Engineering | 13/958,235 | 2013/08/02 |
LEUNG, Woon Fong Wallace (mmwleung);HUNG, Chi-ho (NAME0835) |
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| Multilayer Nanofilber Filter | Germany | Material Tech; Manufacturing Tech | Department of Mechanical Engineering | 112010001912.6 | 2010/05/07 |
LEUNG, Woon Fong Wallace (mmwleung);HUNG, Chi-ho (NAME0835) |
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| 多層納米纖維過濾器 | China | Material Tech; Manufacturing Tech | Department of Mechanical Engineering | 201080031111.9 | 2010/05/07 |
LEUNG, Woon Fong Wallace (mmwleung);HUNG, Chi-ho (NAME0835) |
