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| Official Title | Country | Tech sector | Faculties or Schools | Available for License | Patent Number | Patent Status | Filing Date | Inventor |
|---|---|---|---|---|---|---|---|---|
| Electronic Circuit Board | United States of America | Department of Industrial and Systems Engineering; Department of Electrical and Electronic Engineering | 11/148,444 | 2005/06/09 |
CHENG, Ka Wai Eric (eeecheng);TANG, Chak Yin (mfcytang) |
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| 磨削輔助電化學放電加工工具及方法 | China | Department of Industrial and Systems Engineering | 201010284957.5 | 2010/09/17 |
YUE, Tai Man (NAME0075);LIU, Jiang Wen (NAME0676) |
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| 一種利用拋光生成結構型表面的方法 | China | Department of Industrial and Systems Engineering | 201010560985.5 | 2010/11/26 |
CHEUNG, Chi Fai (mfbenny);KONG, Ling Bao (NAME0417);HO, Lai Ting (mflesley);TO, Suet Sandy (mfsto);LEE, Wing Bun (mfwblee) |
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| 荷葉結構的自清潔塑料膜、表面微型結構及其制備方法 | China | Department of Industrial and Systems Engineering | 201110450694.5 | 2011/12/29 |
TO, Suet Sandy (mfsto);LEE, Wing Bun (mfwblee);WANG, Wen Kui (mfwwk);CHEUNG, Ka Chun (mfkche) |
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| 拋光磨頭 | China | Department of Industrial and Systems Engineering | 201010150477.X | 2010/03/12 |
CHEUNG, Chi Fai (mfbenny);LAI, Kam Tong (A13558);HO, Lai Ting (mflesley);TO, Suet Sandy (mfsto);LEE, Wing Bun (mfwblee);KONG, Ling Bao (NAME0417) |
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| Method and system for encoding and decoding low-density-parity-check (LDPC) codes | United States of America | Department of Industrial and Systems Engineering; Department of Electrical and Electronic Engineering | 12/573,577 | 2009/10/05 |
TAM, Wai Man (wmtam);LAU, Chung Ming (encmlau);TSE, Chi Kong Michael (NAME0211) |
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| 對數據進行編碼及解碼的方法和系統 | China | Department of Industrial and Systems Engineering; Department of Electrical and Electronic Engineering | 201010165252.1 | 2010/05/07 |
TAM, Wai Man (wmtam);LAU, Chung Ming (encmlau);TSE, Chi Kong Michael (NAME0211) |
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| Flexible Capacitive Micromachined Ultrasonic Transducer Array with Increased Effective Capacitance | United States of America | Department of Industrial and Systems Engineering; RIIPT/RIIPT | 12/885,798 | 2010/09/20 |
CHENG, Ching Hsiang (NAME0596);CHEN, Chao (NAME0685) |
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| 具有增加的有效電容的柔性電容式微加工超聲換能器陣列 | China | Department of Industrial and Systems Engineering; RIIPT/RIIPT | 201080041013.3 | 2010/09/21 |
CHENG, Ching Hsiang (NAME0596);CHEN, Chao (NAME0685) |
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| 用於LED路燈的配光透鏡 | China | Green Tech; Material Tech; Smart Hardware | Department of Industrial and Systems Engineering | 200910133428.2 | 2009/04/01 |
JIANG, Jin Bo (NAME0401);TO, Suet Sandy (mfsto);LEE, Wing Bun (mfwblee);CHEUNG, Chi Fai (mfbenny) |
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| Method for Fabrication of Silicone Composite with Antimicrobial Coating | United States of America | ; Material Tech; Smart Hardware | Department of Industrial and Systems Engineering; Innovation and Technology Development Office - PolyU | 12/581,889 | 2009/10/20 |
TANG, Chak Yin (mfcytang);CHEN, Da-zhu (NAME0806);YUE, Tai Man (NAME0075);CHAN, Yuen Yee (NAME0807) |
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| Rapid Fabrication of Porous Metal-based Biomaterial by Microwave Sintering | United States of America | ; Material Tech; Smart Hardware | Department of Industrial and Systems Engineering | 12/458,746 | 2009/07/22 |
TANG, Chak Yin (mfcytang);BAO, Su Ping (C87874);TSUI, Chi Pong (mfgary);YUE, Tai Man (NAME0075) |
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| Strain Sensor | United States of America | ; Material Tech; Smart Hardware | RIIPT/RIIPT; Department of Industrial and Systems Engineering; Department of Applied Physics | 12/325,129 | 2008/11/28 |
CHENG, Ching Hsiang (NAME0596);CHAO, Chen (NAME0520);ZHU, Yun (NAME0769) |
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| 應變傳感器 | China | ; Material Tech; Smart Hardware | RIIPT/RIIPT; Department of Industrial and Systems Engineering; Department of Applied Physics | 200910252377.5 | 2009/11/27 |
CHENG, Ching Hsiang (NAME0596);CHAO, Chen (NAME0520);ZHU, Yun (NAME0769) |
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| 微針陣列、製造該微針陣列的模鑄方法及所使用的模具 | China | ; Material Tech; Smart Hardware | Department of Industrial and Systems Engineering | 200910134816.2 | 2009/04/09 |
XU, Yan (mfxuyan);YUNG, Kai Leung (mfklyung) |
