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Name of invention | Country | Tech sector | Faculties or Schools | Available for License | Patent Number | Patent Status | Filing Date | Inventor |
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Temperature-compensated fibre optic strain gauge | Italy | Material Tech; Manufacturing Tech | Department of Electrical and Electronic Engineering | EP09799986.6 | 2009/07/02 |
TAM, Hwa-yaw; HO, Siu Lau; LIU, Shun-yee Michael; LEE, Kang Kuen; LEE, Kar Yun Tony; HON, Chun Cheong; CHAN, Hing Keung; TAM, Yui Ming Aiken |
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Temperature-compensated fibre optic strain gauge | Netherlands | Material Tech; Manufacturing Tech | Department of Electrical and Electronic Engineering | EP09799986.6 | 2009/07/02 |
TAM, Hwa-yaw; HO, Siu Lau; LIU, Shun-yee Michael; LEE, Kang Kuen; LEE, Kar Yun Tony; HON, Chun Cheong; CHAN, Hing Keung; TAM, Yui Ming Aiken |
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Temperature-compensated fibre optic strain gauge | Turkey | Material Tech; Manufacturing Tech | Department of Electrical and Electronic Engineering | EP09799986.6 | 2009/07/02 |
TAM, Hwa-yaw; HO, Siu Lau; LIU, Shun-yee Michael; LEE, Kang Kuen; LEE, Kar Yun Tony; HON, Chun Cheong; CHAN, Hing Keung; TAM, Yui Ming Aiken |
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Temperature-compensated fibre optic strain gauge | United States of America | Material Tech; Manufacturing Tech | Department of Electrical and Electronic Engineering | 12/850,641 | 2010/08/05 |
TAM, Hwa-yaw; HO, Siu Lau; LIU, Shun-yee Michael; LEE, Kang Kuen; LEE, Kar Yun Tony; HON, Chun Cheong; CHAN, Hing Keung; TAM, Yui Ming Aiken |
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Temperature-compensated Fibre Optic Strain Gauge | United States of America | Material Tech; Manufacturing Tech | Department of Electrical and Electronic Engineering | 12/177,830 | 2008/07/22 |
TAM, Hwa-yaw; HO, Siu Lau; LIU, Shun-yee Michael; LEE, Kang Kuen; LEE, Kar Yun Tony; HON, Chun Cheong; CHAN, Hing Keung; TAM, Yui Ming Aiken |
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變壓器故障氣體監測系統及方法 | China | Green Tech; Energy Tech | Department of Electrical and Electronic Engineering | 200810181820.X | 2008/11/14 |
JIN, Wei; HO, Hoi Lut; JU, Jian |
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A Driving Method for Improving Luminous efficacy of a Light Emitting Diode | United States of America | Energy Tech; Material Tech; ICT | Department of Electrical and Electronic Engineering | 12/366,304 | 2009/02/05 |
LOO, Ka Hong; LUN, Wai-keung; LAI, Yuk Ming; TAN, Siew Chong; TSE, Chi Kong Michael |
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In-wheel Switched Reluctance Motor Drive | United States of America | Energy Tech; Manufacturing Tech; ICT | Department of Electrical and Electronic Engineering | 12/782,700 | 2010/05/19 |
CHENG, Ka Wai Eric; XUE, Xiangdang; CHEUNG, Norbert C. |
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Electroinc Stiumlation Textile for Traditional Chinese Medicine Therapy | United States of America | Health Tech; Fashion & Textile; ICT | School of Nursing; Department of Electrical and Electronic Engineering; School of Fashion and Textiles; FHSS/FHSS | 12/569,893 | 2009/09/29 |
LI, Li; AU, Wai Man Raymond; WONG, Kwok Shing Thomas; LI, Yi; WAN, Kam Man; WAN, Sai-ho |
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Fiber Bragg Grating Devices and Related Method | United States of America | Material Tech; Manufacturing Tech; ICT | Department of Electrical and Electronic Engineering; Department of Mechanical Engineering | 12/470,367 | 2009/05/21 |
WANG, Dongning; LI, Yuahua; LU, Jian |
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對數據進行編碼及解碼的方法和系統 | China | ICT; Manufacturing Tech; ICT | Department of Industrial and Systems Engineering; Department of Electrical and Electronic Engineering | 201010165252.1 | 2010/05/07 |
TAM, Wai Man; LAU, Chung Ming; TSE, Chi Kong Michael |
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Method and system for encoding and decoding low-density-parity-check (LDPC) codes | United States of America | ICT; Manufacturing Tech; ICT | Department of Industrial and Systems Engineering; Department of Electrical and Electronic Engineering | 12/573,577 | 2009/10/05 |
TAM, Wai Man; LAU, Chung Ming; TSE, Chi Kong Michael |
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一種使用導電黏合劑黏接電氣設備的方法及系統 | China | Material Tech; Manufacturing Tech; ICT | Department of Electrical and Electronic Engineering | 201010262578.6 | 2010/08/24 |
OR, Siu-wing Derek |
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使用導電膠黏合電氣裝置的方法與系統 | Taiwan | Material Tech; Manufacturing Tech; ICT | Department of Electrical and Electronic Engineering | 099128156 | 2010/08/24 |
OR, Siu-wing Derek |
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Method and system for bonding electrical devices using an electrically conductive adhesive | United States of America | Material Tech; Manufacturing Tech; ICT | Department of Electrical and Electronic Engineering | 13/340,168 | 2011/12/29 |
OR, Siu-wing Derek |