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Official Title Country Tech sector Faculties or Schools Available for License Patent Number Patent Status Filing Date Inventor
用於電線接合機之接合裝置 Taiwan Department of Electrical and Electronic Engineering; Department of Applied Physics 94100146 2005/01/04

OR, Siu-wing Derek (eeswor);YUNG, Chung-sheung (NAME0269);CHAN WONG, Lai Wa Helen (NAME0040)

Driver for an UltrasonicTransducer and an Ultrasonic Transducer Malaysia Department of Electrical and Electronic Engineering; Department of Applied Physics PI 20050021 2005/01/04

OR, Siu-wing Derek (eeswor);YUNG, Chung-sheung (NAME0269);CHAN WONG, Lai Wa Helen (NAME0040)

NON-INVASIVE GLUCOSE SENSOR United States of America Department of Applied Physics 13/075,027 2011/03/29

YAN, Feng (apafyan);CHAN WONG, Lai Wa Helen (NAME0040);TANG, Hao (NAME0889)

一種非介入式葡萄糖傳感器 China Department of Applied Physics 201210088827.3 2012/03/29

YAN, Feng (apafyan);CHAN WONG, Lai Wa Helen (NAME0040);TANG, Hao (NAME0889)

Strain Sensor United States of America RIIPT/RIIPT; Department of Industrial and Systems Engineering; Department of Applied Physics 12/325,129 2008/11/28

CHENG, Ching Hsiang (NAME0596);CHAO, Chen (NAME0520);ZHU, Yun (NAME0769)

應變傳感器 China RIIPT/RIIPT; Department of Industrial and Systems Engineering; Department of Applied Physics 200910252377.5 2009/11/27

CHENG, Ching Hsiang (NAME0596);CHAO, Chen (NAME0520);ZHU, Yun (NAME0769)

Polymer-Bonded Magnetic Materials United States of America Department of Electrical and Electronic Engineering; Department of Applied Physics 12/039,592 2008/02/28

CHENG, Ka Wai Eric (eeecheng);WONG, Yuen-wah (NAME0114);WU, Wei Tai (NAME0693);DING, Kai (kding);HO, Yiu Lun (NAME0694);CHEUNG, Tsz Kong (NAME0695);CHEONG, Chi Keong (NAME0453)

聚合物粘合的磁性材料 China Department of Electrical and Electronic Engineering; Department of Applied Physics 200810099551.2 2008/05/15

CHENG, Ka Wai Eric (eeecheng);WONG, Yuen-wah (NAME0114);WU, Wei Tai (NAME0693);DING, Kai (kding);HO, Yiu Lun (NAME0694);CHEUNG, Tsz Kong (NAME0695);CHEONG, Chi Keong (NAME0453)

Fluidic piezoresistive strain gauge United States of America RIIPT/RIIPT; Department of Industrial and Systems Engineering; Department of Applied Physics 12/007,610 2008/01/14

CHENG, Ching Hsiang (NAME0596);CHAO, Chen (NAME0520);CHEUNG, Yin Nee (NAME0597)

微波濾波網絡薄膜移相器及其制備方法 China Department of Applied Physics 200710149651.7 2007/09/10

WANG, Yu (NAME0662);CHAN WONG, Lai Wa Helen (NAME0040);CHEN, Xuejiao (NAME0663)

Polymer microvalve with actuators and devices United States of America RIIPT/RIIPT; Department of Industrial and Systems Engineering; Department of Applied Physics 11/984915 2007/11/26

CHENG, Ching Hsiang (NAME0596);CHAO, Chen (NAME0520);CHEUNG, Yin Nee (NAME0597)

Fabrication of Piezoelectric Single Crystalline Thin Layer on Silicon Wafer United States of America Department of Applied Physics 11/892,313 2007/08/22

PENG, Jue (NAME0633);CHAO, Chen (NAME0520);DAI, Jiyan (apdaijy);CHAN WONG, Lai Wa Helen (NAME0040)

Piezoresistive Strain Gauge Using Doped Polymeric Fluid United States of America RIIPT/RIIPT; Department of Industrial and Systems Engineering; Department of Applied Physics 11/822042 2007/07/02

CHENG, Ching Hsiang (NAME0596);CHAO, Chen (NAME0520);CHEUNG, Yin Nee (NAME0597)

使用摻雜聚合流體的壓阻式應變計 China RIIPT/RIIPT; Department of Industrial and Systems Engineering; Department of Applied Physics 200810137642.0 2008/07/02

CHENG, Ching Hsiang (NAME0596);CHAO, Chen (NAME0520);CHEUNG, Yin Nee (NAME0597)

鈮酸鈉鉀鋯鈦酸鋇系無鉛壓電陶瓷組合物 China Department of Applied Physics 200710006787.2 2007/02/06

LIN, Dunmin (NAME0570);KWOK, KIn-wing (apkwkwok);CHAN WONG, Lai Wa Helen (NAME0040)